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Empower Semiconductor Launches High-Density Silicon Capacitors for AI Chip Co-Packaging

SEMICONDUCTOR

Empower Semiconductor introduced three embedded silicon capacitors (ECAPs) designed for AI and HPC chips, enhancing power integrity by being co-packaged with processors. The EC2005P, EC2025P, and EC2006P offer capacitances of 9.34 μF, 18.68 μF, and 36.8 μF, respectively.

These capacitors address the challenges posed by high current demands in AI workloads, improving transient response and voltage stability. Empower also announced integrated voltage regulators (IVRs) to further optimize power delivery, supporting the growing need for efficient power management in high-performance computing.

Empower Semiconductor Launches High-Density Silicon Capacitors for AI Chip Co-Packaging
Feb 22, 2026, 6:24 AM

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