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The World Fab Forecast report indicates that the Americas and Japan are leading semiconductor fab construction projects, each with four planned for 2026. China and Europe & Middle East regions each have three, while Taiwan has two, and Korea and Southeast Asia have one.

The 18 new projects consist of three 200mm and fifteen 300mm facilities, with most starting operations within two years. Advanced nodes are driving capacity expansion, projected to reach 33.6 million wafers per month by 2025.