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Broadcom has produced the first custom SoC using a 2nm process, intended for Fujitsu's FugakuNEXT supercomputer. The chip, manufactured by TSMC, features 144 Armv9 cores and advanced memory and connectivity technologies.

Notably, it employs a 3.5D XDSiP packaging platform designed to enhance signal density and reduce power consumption. Broadcom aims to expand its role in the advanced semiconductor market, with additional XPU platforms set for production in late 2026 for other AI clients.