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Chipbond Technology Corporation has inaugurated its new advanced semiconductor manufacturing facility in Penang, Malaysia, with an investment of approximately $200 million. The facility aims to enhance Malaysia's position in the global outsourced semiconductor assembly and test (OSAT) value chain and support local technology capabilities. The plant will focus on wafer bumping and chip-scale packaging, with expected internal qualification by the end of 2025 and customer qualification starting in Q1 2026.