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EV Group has introduced the next-generation EVG®120 automated resist processing system, featuring enhanced capabilities for high-volume manufacturing. The system, optimized for flexibility, includes in-situ resist thickness metrology, wafer edge exposure, and a compact design that improves throughput and process control. It will be showcased at the SPIE Advanced Lithography and Patterning Conference from February 22-26, 2026, in San Jose, California.