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Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have partnered to advance semiconductor packaging and heterogeneous integration. The initiative will establish a joint R&D center in Fishkill, NY, focusing on design-to-manufacturing services and mass customization of semiconductor devices.

Key technologies include GLS's ChipForge™ and APES's Matrix6D AME platform, facilitating applications in various sectors. The collaboration begins immediately, transitioning to GLS facilities by Q3 2026, aiming to enhance North America's semiconductor supply chain.