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Purdue University has secured $129,072 from the Trask Innovation Fund to advance projects in concrete, imaging, and semiconductors, with individual awards reaching up to $50,000. The funding will support the development of a hydrogel-based curing agent for concrete, enhancements in AI for digital pathology, and scaling the manufacturing of 2D tellurene for electronic devices. The next application deadline for Trask funding is February 20.