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D-Wave has unveiled a significant advancement in its upcoming gate model quantum computer by utilizing semiconductor technology to drastically reduce the number of control wires needed, from thousands to a minimal amount. This innovation, achieved through bump bonding in collaboration with SkyWater Technology, integrates on-chip control with the quantum processor while maintaining superconducting connections to mitigate heat generation. The new design enhances scalability and modularity, allowing for the seamless addition of quantum processing units.