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Imec is enhancing its photonic integrated circuits (PICs) and co-packaged optics (CPO) to meet the demands of AI and datacom sectors. The company is advancing pluggable optical transceivers capable of 400-Gbit/s and 3.2-Tbit/s optics while integrating optical engines into ASIC packages to reduce power consumption and improve signal integrity. Imec also targets emerging applications in sensing and quantum computing, leveraging its ultralow-loss silicon nitride platform.