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Core Micro Systems Inc. will serve as a Platinum sponsor at 'SCA/HPCAsia 2026' in Osaka, showcasing advanced AI HPC solutions designed for supercomputing. Key presentations will cover a Grid Scale-out AI HPC Modular Platform, a Global Multi-cloud AI HPC Resource Orchestration Solution, and innovations in container modular data centers aimed at enhancing integration and reducing costs. The company will also highlight its aisle-connected expandable container technology, which simplifies installation and supports significant cooling capacities.