Article

The Danish Technological Institute and Heatflow have developed a 3D-printed cooling component that significantly reduces energy consumption in data centers through a passive two-phase cooling method. The prototype, achieving a cooling capacity of 600 watts, utilizes complex internal geometries to enhance heat transport, making it a promising solution as modern GPUs and servers surpass traditional cooling limits. This innovation not only lowers cooling energy requirements but also has potential applications in district heating networks.