Intel Unveils First Glass Core Substrates with EMIB for Advanced AI Chip Packaging
DATA AND AI INFRASTRUCTURE
Intel has introduced its 'Thick Core' glass substrate with EMIB packaging technology at NEPCON Japan, aimed at enhancing AI chip performance for data center applications. This new substrate features a compact design that supports multiple compute dies and complex chiplet configurations. Additionally, Intel is considering a partnership with UMC to license its Super MIM capacitor technology, which addresses critical challenges in advanced packaging for high-performance computing.
Jan 23, 2026, 7:07 PM
