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At NEPCON Japan 2026, Intel unveiled a new high-performance glass substrate featuring EMIB technology, tailored for AI accelerators and HPC solutions. The substrate, measuring 78 x 77 mm, supports complex multi-chiplet configurations and enhances connection density with a 10-2-10 structure, while also offering improved heat resistance and mechanical stability over traditional organic substrates. Intel reported successful testing with no SeWaRe issues, marking significant advancements in material science and production processes.