Article

MemryX Inc. has announced its roadmap for the MX4, a next-generation accelerator designed to enhance AI inference in data centers through a 3D hybrid-bonded memory architecture. The MX4 aims to improve memory capacity, bandwidth, and energy efficiency, building on the MX3's performance advantages, while focusing on asynchronous processing to support larger workloads like Large Action Models and high-resolution multimodal vision. A dedicated test chip is expected by 2026, developed in partnership with a 3D memory provider.