Molex Launches Impress Co-Packaged Copper Solutions for 224Gbps Connectivity in AI Data Centers
DATA AND AI INFRASTRUCTURE
Molex has introduced Impress Co-Packaged Copper Solutions, designed for 224Gbps PAM-4 connectivity in AI and hyperscale data centers. This innovative solution utilizes a compression-based, on-substrate connector to optimize signal integrity and power distribution.
With over one million units of NearStack OTS already delivered, Impress aims to enhance scalability and reduce latency in server architectures. Molex will showcase these technologies at DesignCon 2026 in Santa Clara.
Feb 18, 2026, 2:55 PM
