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A groundbreaking 3D chip has been unveiled in the USA, developed through collaboration with top universities and SkyWater Technology. Featuring a vertical architecture that addresses the 'memory wall' limitation of traditional processors, the chip boasts data transfer speeds up to four times faster than 2D counterparts, with potential future improvements of up to twelve times. This innovation also enhances energy efficiency, marking a significant advancement for AI, supercomputers, and the computing industry as a whole.