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SEMIFIVE has secured multiple AI semiconductor design projects in Japan and established a subsidiary in Tokyo, enhancing its global expansion efforts. The projects focus on developing high-performance semiconductors for AI and data center applications, leveraging SEMIFIVE's expertise in advanced process nodes and turnkey design for large-die chips.

These projects will utilize next-generation technologies like 3D IC-based advanced packaging to improve efficiency, reduce energy consumption, and increase integration density. The move aligns with the growing demand for high-performance chips in Japan, supported by government investment and initiatives to build a robust AI ecosystem.