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SK Hynix Inc. plans to invest 19 trillion won ($12.9 billion) to expand its chip packaging capacity in Cheongju, South Korea, to meet the rising demand for high-bandwidth memory (HBM) driven by AI data center growth. The facility is expected to break ground in April and be completed by the end of 2027, addressing critical packaging bottlenecks amid tightening global memory supply. The company projects a 33% annual growth in the HBM market from 2025 to 2030, highlighting the need for proactive supply planning in light of persistent shortages.