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TDK Corporation has launched the FS1525, a 3.82 mm high non-isolated DC-DC power module that supports up to 25 A. Designed for AI servers and data centers, it can be stacked to deliver up to 200 A. The FS1525 features advanced 3D chip-embedded technology, thermal efficiency, and supports input voltages from 4.5 V to 16 V.

It integrates various components into a compact footprint and is optimized for low-voltage AI processors. The module includes digital programmability for real-time monitoring and is compatible with various computing form factors.