Technological Institute and Heatflow Develop Energy-Efficient 3D-Printed Cooling Solution for Data Centers
DATA AND AI INFRASTRUCTURE
The Technological Institute and Heatflow have unveiled an innovative energy-efficient cooling solution for data centers, achieved through 3D printing in the AM2PC project. This passive two-phase cooling system, which operates without pumps, has exceeded its cooling capacity target by reaching 600 watts, addressing the increasing energy demands of data centers, particularly in regions like Ireland. The project, with a budget of DKK 10 million, runs from 2023 to 2025 and involves collaboration among partners from Denmark, Belgium, and Germany.

Jan 6, 2026, 11:48 PM