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Toppan Inc. has completed a new manufacturing line for flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, aiming for mass production by the end of the current fiscal year. This initiative responds to the increasing demand for high-density semiconductor packaging driven by data centers and AI workloads.

The new line will approximately double the plant's FC-BGA capacity compared to first-half fiscal 2022 levels and incorporates advancements for improved electrical performance. It can handle greater substrate thickness and size formats, utilizing enhanced inspection measures and autonomous mobile robots for efficiency.

Toppan plans to complement this capacity with a second site in Singapore, set to begin operations in late 2026, enhancing its global supply chain in semiconductor packaging. This strategy reflects Toppan's commitment to semiconductor packaging as a key component of its electronics segment, focusing on next-generation requirements for AI and data-centric applications.